Ilya Karpov Email & Phone Number | Senior Technologist and project leader for front and back-end critical process technologies with in-depth process integration and material processing expertise for next-generation and advanced node technologies. Broad and in-depth hands-on experience in advanced node back-end process integration, advanced back-end memory technologies, materials-process-design-performance interactions, novel thin-film technologies, memory array characterization, and data set analysis. Consistently delivered process and integration inventions, and novel device demonstrations, with multiple leading-edge technology transfers to product development. Co-authored high-impact device technology papers with over 3000 citations. Led path-finding phases for PCM, 3DXpoint, embedded RRAM, and other industry breakthroughs with fundamental inventions. Stanford-certified project manager with unique experience in leading international cross-functional teams to overcome major technical challenges.

Ilya Karpov

Senior Technologist and project leader for front and back-end critical process technologies with in-...
Portland, Oregon, United States

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Ilya Karpov’s Email ilya.karpov@intel.com

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Ilya Karpov’s Location Portland, Oregon, United States

Ilya Karpov’s Current Industry Intel

Ilya Karpov’s Prior Industry Intel California Technology And Manufacturing | Mitsubishi Silicon America

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Sr. Engineer, Components Research

2011-10-01 00:00:00 - Present

Process Integration Engineer, Pathfinding

2002-01-01 00:00:00 - 2011-10-01 00:00:00

Product Development Engineer, Research and Development Group

1997-01-01 00:00:00 - 1999-12-01 00:00:00

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Ilya Karpov is a Senior Technologist and project leader for front and back-end critical process technologies with in-depth process integration and material processing expertise for next-generation and advanced node technologies. Broad and in-depth hands-on experience in advanced node back-end process integration, advanced back-end memory technologies, materials-process-design-performance interactions, novel thin-film technologies, memory array characterization, and data set analysis. Consistently delivered process and integration inventions, and novel device demonstrations, with multiple leading-edge technology transfers to product development. Co-authored high-impact device technology papers with over 3000 citations. Led path-finding phases for PCM, 3DXpoint, embedded RRAM, and other industry breakthroughs with fundamental inventions. Stanford-certified project manager with unique experience in leading international cross-functional teams to overcome major technical challenges.