Yungta Li Email & Phone Number | Until now, I have over 11 years working experience in semiconductor from frond-end (Transistor manufacture) to back-end (Advanced package). For job function is also from R&D-PE to Q&R-QE, and then to PM (project manager), which can let me overall understand this industry to find out my position. Work 1: R&D-PE & PIE at TSMC 1. Process module in path finding beyond 14nm technology (FinFET & Nanowire FET) 2. Co-work w/ vendor and supplier to verify new equipment & develop new materials 3. Pilot research in new semiconductor material as Si-Ge, Ge & III-V Work 2: Q&R-QE at TSMC 1. Enhance/sustain quality & reliability of supply chain to meet fab’s needs 2. Identify/review acceptance item and spec of incoming materials from SPC management 3. Develop/manage 1st & 2nd source (BASF, PPC, MGC & Nagase et al.) for cost reduction 4. Manufacture risk/measurement review & management by PCN (process change notice) & MSA (Measurement system analysis) 5. Transfer risk review of new material between R&D & mass production Work 3: R&D-PM at SPIL (Siliconware Precision Industries Co., Ltd.) 1. Project development & management of new product as below experiences - Substrate (unit) form: 2.1D, HBW (High band width) - Wafer form: Silicon Photonics; FOEB (Fan-out embedded die); FOEB+2.5D integration (like as CoWoS-L of tsmc) 2. Process risk and capability review, and identify process flow of new device 3. Manage project milestone to meet customer’s development schedule & request 4. Integrate & arrange resource between PE, PIE & cross department Above working experience summary, let me know the favorites that understand the unknown area and learn skills in different job position. From semiconductor to advanced package, I show my passion to submit several papers and patents, and also experience many challenges on high stress projects, expect that can provide wide suggestions and ideals, and also help me to get started as soon as possible in my future job.

Yungta Li

Until now, I have over 11 years working experience in semiconductor from frond-end (Transistor manuf...
Taichung City, Taichung City, Taiwan

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Yungta Li’s Email yungta.l@spil.com.cn

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Yungta Li’s Location Taichung City, Taichung City, Taiwan

Yungta Li’s Current Industry 矽品

Yungta Li’s Prior Industry 台積電

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Work Experience

矽品

Technical Project Manager

2017-09-01 00:00:00 - Present

Tsmc

Principal Engineer

Present

台積電

Principal Engineer

2015-01-01 00:00:00 - 2017-09-01 00:00:00

Skills

No Skills Available

Languages

No Languages Available

FAQ About Yungta Li

Yungta Li is located at
Taichung City, Taichung City, Taiwan

Yungta Li is a Until now, I have over 11 years working experience in semiconductor from frond-end (Transistor manufacture) to back-end (Advanced package). For job function is also from R&D-PE to Q&R-QE, and then to PM (project manager), which can let me overall understand this industry to find out my position. Work 1: R&D-PE & PIE at TSMC 1. Process module in path finding beyond 14nm technology (FinFET & Nanowire FET) 2. Co-work w/ vendor and supplier to verify new equipment & develop new materials 3. Pilot research in new semiconductor material as Si-Ge, Ge & III-V Work 2: Q&R-QE at TSMC 1. Enhance/sustain quality & reliability of supply chain to meet fab’s needs 2. Identify/review acceptance item and spec of incoming materials from SPC management 3. Develop/manage 1st & 2nd source (BASF, PPC, MGC & Nagase et al.) for cost reduction 4. Manufacture risk/measurement review & management by PCN (process change notice) & MSA (Measurement system analysis) 5. Transfer risk review of new material between R&D & mass production Work 3: R&D-PM at SPIL (Siliconware Precision Industries Co., Ltd.) 1. Project development & management of new product as below experiences - Substrate (unit) form: 2.1D, HBW (High band width) - Wafer form: Silicon Photonics; FOEB (Fan-out embedded die); FOEB+2.5D integration (like as CoWoS-L of tsmc) 2. Process risk and capability review, and identify process flow of new device 3. Manage project milestone to meet customer’s development schedule & request 4. Integrate & arrange resource between PE, PIE & cross department Above working experience summary, let me know the favorites that understand the unknown area and learn skills in different job position. From semiconductor to advanced package, I show my passion to submit several papers and patents, and also experience many challenges on high stress projects, expect that can provide wide suggestions and ideals, and also help me to get started as soon as possible in my future job.