Wai Shan Liau Email & Phone Number | 6 year experience in handling eutectic/epoxy/soft solder/Cu pillar flip chip die bonding process & stencil printing, Cu clip bonding & reflow. Worked as package development, process integration and process sustaining engineer Personal Profile

Wai Shan Liau

6 year experience in handling eutectic/epoxy/soft solder/Cu pillar flip chip die bonding process & s...
Seremban, Negri Sembilan, Malaysia

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Wai Shan Liau’s Email wai.liau@infineon.com

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Wai Shan Liau’s Location Seremban, Negri Sembilan, Malaysia

Wai Shan Liau’s Current Industry Infineon Technologies

Wai Shan Liau’s Prior Industry On Semiconductor | Seremban Engineering Berhad

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Senior Die Bond Unit Process Engineer

2017-09-01 00:00:00 - Present

Package Development Die Bond Process Engineer

2012-11-01 00:00:00 - 2014-10-01 00:00:00

Estimation Engineer

2012-07-01 00:00:00 - 2012-11-01 00:00:00

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Wai Shan Liau is a 6 year experience in handling eutectic/epoxy/soft solder/Cu pillar flip chip die bonding process & stencil printing, Cu clip bonding & reflow. Worked as package development, process integration and process sustaining engineer Personal Profile