Tee Keng Tan Email & Phone Number | An experienced, highly motivated and proactive engineer with strong focus on RF and Hardware development, with grounded knowledge in system RF and compliance qualifications for 2G/3G/4G, GNSS, WiFi and millimeter wave. Experienced Lead Design Engineer with more than 17 years exposure with World Top Semiconductor companies across various applications in wide spectrum such as Architect, System Engineering, Hardware Design and PCB Board Design, Component Qualification And HFSS/SI Simulation to Production Testing. Proven track record in leading the breakthrough design, implementation and validation of RF and hardware with 3 major projects successfully delivered in my career. Achieved 3 product in RF transceivers and CMOS Power amplifier customer projects. Possess good communication skills to collaborate with cross-functional teams across multiple sites, and strong camaraderie across many Intel R&D and Customer Support teams. Able to work independently, as well as being flexible and creative. Conversant with Intel Hardware design methodology including PCB CAD tools and RF simulation tools.

Tee Keng Tan

An experienced, highly motivated and proactive engineer with strong focus on RF and Hardware develop...
Singapore

*50 free lookup(s) per month.

Tee Keng Tan’s Email tee.tan@intel.com

Tee Keng Tan’s Phone Numbers

Get TEE’s Phone Number (For Free)

Social Media

Tee Keng Tan’s Location Singapore

Tee Keng Tan’s Current Industry Intel

Tee Keng Tan’s Prior Industry Infineon Technologies Asia Pacific | Iwow Communications | Kenwood

Find accurate emails & phone numbers for over 700M professionals.

Member Of Technical Staff

2016-08-01 00:00:00 - Present

Staff Rf Engineer

2005-05-01 00:00:00 - 2011-06-01 00:00:00

Senior Hardware Developer

2001-01-01 00:00:00 - 2005-04-01 00:00:00

Rf Engineer

1996-07-01 00:00:00 - 1998-02-01 00:00:00

No Skills Available

No Languages Available

Tee Keng Tan is a An experienced, highly motivated and proactive engineer with strong focus on RF and Hardware development, with grounded knowledge in system RF and compliance qualifications for 2G/3G/4G, GNSS, WiFi and millimeter wave. Experienced Lead Design Engineer with more than 17 years exposure with World Top Semiconductor companies across various applications in wide spectrum such as Architect, System Engineering, Hardware Design and PCB Board Design, Component Qualification And HFSS/SI Simulation to Production Testing. Proven track record in leading the breakthrough design, implementation and validation of RF and hardware with 3 major projects successfully delivered in my career. Achieved 3 product in RF transceivers and CMOS Power amplifier customer projects. Possess good communication skills to collaborate with cross-functional teams across multiple sites, and strong camaraderie across many Intel R&D and Customer Support teams. Able to work independently, as well as being flexible and creative. Conversant with Intel Hardware design methodology including PCB CAD tools and RF simulation tools.