Severino Legaspi Email & Phone Number | He has extensive experience in microelectronic IC packaging design & process development engineering with strong background in quality/reliability engineering and project management. His expertise and skills : • Developing & integrating manufacturing processes to deploy new high performance packaging designs & tooling technology (DFM/DFx) • Selection, qualification and reliability testing of new materials, packaging technology,tools/ equipment and suppliers. • Design concept to NPI of microelectronics packaging and MEMS packaging (laminates to hybrid/MCM & leadframe-based) emphasis on risk management. • Developing and integrating of assembly & test processes toward improved cost structures • Managing multi-regional partners: materials & equipment suppliers/ assembly subcontractors (CM's & EOM's). • Managing packaging costing/pricing & perform value-added assessments. • Manufacturing equipment development with hands-on production line expertise. Specialties: -Packaging Design, Process & Packaging Development Engineering, Project Management, Quality & Reliability Engg,, -Materials and Equipment Development, Six Sigma ( Kaizen), NPI Program Management (TTM ), Automotive technology/Process, Production/process Automation.

Severino Legaspi

He has extensive experience in microelectronic IC packaging design & process development engineering...
San Francisco, California, United States

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Severino Legaspi’s Email severino.legaspi@flex.com

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Severino Legaspi’s Location San Francisco, California, United States

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Sr Engr/CM Manager, Integration & Assembly Manufacturing/Engineering

2015-01-01 00:00:00 - 2016-01-01 00:00:00

Sr Mfg Engr IV (Staff), Microelectronics Packaging (R&D)

2013-12-01 00:00:00 - 2015-10-01 00:00:00

Packaging & Process Devt Engineering

2010-12-01 00:00:00 - 2013-04-01 00:00:00

Manager, Assembly Packaging Engg/ Quality&Rel Engg

2005-05-01 00:00:00 - 2008-06-01 00:00:00

Sr. Engineer,Assembly Packaging & Process Development Engg.

2001-05-01 00:00:00 - 2004-10-01 00:00:00

Section Manager/Supervisory Engr, Process Development Engg

1990-02-01 00:00:00 - 2000-01-01 00:00:00

Section Head (Manager), Process Engineering/Quality Engineering

1987-01-01 00:00:00 - 1990-01-01 00:00:00

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Severino Legaspi is a He has extensive experience in microelectronic IC packaging design & process development engineering with strong background in quality/reliability engineering and project management. His expertise and skills : • Developing & integrating manufacturing processes to deploy new high performance packaging designs & tooling technology (DFM/DFx) • Selection, qualification and reliability testing of new materials, packaging technology,tools/ equipment and suppliers. • Design concept to NPI of microelectronics packaging and MEMS packaging (laminates to hybrid/MCM & leadframe-based) emphasis on risk management. • Developing and integrating of assembly & test processes toward improved cost structures • Managing multi-regional partners: materials & equipment suppliers/ assembly subcontractors (CM's & EOM's). • Managing packaging costing/pricing & perform value-added assessments. • Manufacturing equipment development with hands-on production line expertise. Specialties: -Packaging Design, Process & Packaging Development Engineering, Project Management, Quality & Reliability Engg,, -Materials and Equipment Development, Six Sigma ( Kaizen), NPI Program Management (TTM ), Automotive technology/Process, Production/process Automation.

Severino Legaspi has prior
experience in the following industries:
Thin Film Electronics | Flex | Silicon Microstructures | Quicklogic | Lsi Logic | Advanced Interconnect Technologies | Texas Instruments

Severino Legaspi has the following professional experience:
Thin Film Electronics | Flex | Silicon Microstructures | Quicklogic | Lsi Logic | Advanced Interconnect Technologies | Texas Instruments