Ng Syen Uun Email & Phone Number | Roles & Responsibilities: * Standardization of new equipment/process characterization for new package development phase * Drive equipment OEE for meeting company goal (cost, productivity output, UPH) * Lead and derive DACA machine selection according to R&D raodmap approach (Clip bond -DACA process, equipment tooling line config) * Coordinate for process spec, work instruction, process flow, build sheet for production ramp up plan (from VRU to HVM phase) * SME DACA process development for clip bonding LFPAK, QFN, SiP, FPBGA, Flip Chip, GaN device * Synergized and cultivate with new tech breakthrough approach for new equipment introduction * Define and implement DACA tooling design rule that compatible used as universal tooling configured in LFPAKxx series * Machine scouting activity according to company R&D roadmap * Lead as excecutor for DACA usergroup community X site activity

Ng Syen Uun

Roles & Responsibilities: * Standardization of new equipment/process characterization for new packag...
Dongguan, Guangdong, China

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Ng Syen Uun’s Location Dongguan, Guangdong, China

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Ng Syen Uun’s Prior Industry Utac | Lumileds | Osram | Osram Opto Semiconductors | Ann Joo Resources

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Be Daca Process/Equipment Development Manager

2020-03-01 00:00:00 - Present

Principal Engineer

2019-06-01 00:00:00 - 2020-02-01 00:00:00

Sr. Process And Pkg Development Engineer

2018-06-01 00:00:00 - 2019-05-01 00:00:00

Senior Process Engineer

2012-01-01 00:00:00 - 2018-05-01 00:00:00

Process Engineer

2006-08-01 00:00:00 - 2011-12-01 00:00:00

Production Enginner

2004-10-01 00:00:00 - 2006-08-01 00:00:00

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Ng Syen Uun is a Roles & Responsibilities: * Standardization of new equipment/process characterization for new package development phase * Drive equipment OEE for meeting company goal (cost, productivity output, UPH) * Lead and derive DACA machine selection according to R&D raodmap approach (Clip bond -DACA process, equipment tooling line config) * Coordinate for process spec, work instruction, process flow, build sheet for production ramp up plan (from VRU to HVM phase) * SME DACA process development for clip bonding LFPAK, QFN, SiP, FPBGA, Flip Chip, GaN device * Synergized and cultivate with new tech breakthrough approach for new equipment introduction * Define and implement DACA tooling design rule that compatible used as universal tooling configured in LFPAKxx series * Machine scouting activity according to company R&D roadmap * Lead as excecutor for DACA usergroup community X site activity