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Minjae Lee

Sr. Director - Product Line SiP
Chandler, Arizona, United States

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semiconductors hardware information technology ic test wafer bumping mems sensors wafer level packaging 3d packaging tsv flip chip packageonpackage sip chiponchip wafer test ic design leadframe laminate wlfo semiconductor csp bga power discretes dsmbga advanced packaging wlcsp automotive iot ai computing memory

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