Mike Michaud Email & Phone Number | I am a Project Manager with 25+ years of experience in the semiconductor industry, specifically in back end chip connect. I have install qual experience in all aspects of FAB tooling from design/build/production through to decon/demo/reuse. I possess broad knowledge of C4 and TSV technologies as they pertain to process development, microscopy failure analysis and continuous equipment improvement project management. This has included working directly with global vendors and suppliers to develop quality supply chains, improve equipment availability, and adapt to a dynamic engineering change control cycle. These responsibilities also allowed me to gain hands on experience affecting multiple process development efforts for products that would become the next generation of chip connection packages.

Mike Michaud

I am a Project Manager with 25+ years of experience in the semiconductor industry, specifically in b...
Portland, Oregon, United States

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Mike Michaud’s Location Portland, Oregon, United States

Mike Michaud’s Current Industry Intel

Mike Michaud’s Prior Industry Aspen International

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Project Manager

2021-08-01 00:00:00 - Present

Cable Systems Drafter

1996-02-01 00:00:00 - 1997-06-01 00:00:00

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Mike Michaud is a I am a Project Manager with 25+ years of experience in the semiconductor industry, specifically in back end chip connect. I have install qual experience in all aspects of FAB tooling from design/build/production through to decon/demo/reuse. I possess broad knowledge of C4 and TSV technologies as they pertain to process development, microscopy failure analysis and continuous equipment improvement project management. This has included working directly with global vendors and suppliers to develop quality supply chains, improve equipment availability, and adapt to a dynamic engineering change control cycle. These responsibilities also allowed me to gain hands on experience affecting multiple process development efforts for products that would become the next generation of chip connection packages.