Mauro Kobrinsky Email & Phone Number | Mauro J. Kobrinsky received his Ph.D. from the Massachusetts Institute of Technology in 2001. He is currently the Director of Interconnects Structures and Architectures in Components Research, Intel. He has made contributions in the area of Si processing, including metallization, dielectrics, interconnects airgap, reliability, interconnects modelling, I/O, Si Photonics, functional materials, die-package interactions, 3D integration, transistor contacts, as well as Back-Side Power Delivery, for which he lead the PowerVia research efforts. He has over 110 patents issued, and more than 35 papers and conference presentations. Dr. Kobrinsky has served as a member of the Technical Advisory Board for the Interconnects and Packaging Science area of the Global Research Consortium (GRC), and as member of the ITRS Interconnect roadmap team.

Mauro Kobrinsky

Mauro J. Kobrinsky received his Ph.D. from the Massachusetts Institute of Technology in 2001. He is...
Portland, Oregon, United States

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Mauro Kobrinsky’s Location Portland, Oregon, United States

Mauro Kobrinsky’s Current Industry Intel

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Intel Fellow, Director of Novel Interconnect Structures and Architectures

2023-11-01 00:00:00 - Present

Engineer

1994-01-01 00:00:00 - 1996-01-01 00:00:00

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Mauro Kobrinsky is a Mauro J. Kobrinsky received his Ph.D. from the Massachusetts Institute of Technology in 2001. He is currently the Director of Interconnects Structures and Architectures in Components Research, Intel. He has made contributions in the area of Si processing, including metallization, dielectrics, interconnects airgap, reliability, interconnects modelling, I/O, Si Photonics, functional materials, die-package interactions, 3D integration, transistor contacts, as well as Back-Side Power Delivery, for which he lead the PowerVia research efforts. He has over 110 patents issued, and more than 35 papers and conference presentations. Dr. Kobrinsky has served as a member of the Technical Advisory Board for the Interconnects and Packaging Science area of the Global Research Consortium (GRC), and as member of the ITRS Interconnect roadmap team.