Mandar Shinde Email & Phone Number | Experience in developing electronic packages & systems with scope in mechanical design (CAD), simulations (FEA) and characterization (Lab), assembly manufacturing processes, and enabling external suppliers. • Experience in developing LGA, FC-BGA architecture based electronic packages and sockets for LGA packages used in servers including test vehicles. • Mechanical simulations and testing expertise in 1) down selecting architectures, processes and materials that provide the best yield and reliability, 2) identifying technical root causes for thermomechanical assembly issues and providing solution options. • Experience in leading teams, project management, working with suppliers and yield improvement. Skills - • Product design, FEA analysis, assembly & manufacturability, and lab testing. • Design for manufacturability, yield, and reliability of semiconductor packages. • Manufacturing statistics, design of experiments, and technical problem solving. • Hands-on expertise in thermo-mechanical characterization and reliability testing of electronic packages. • New test methodology development, fixture design, rapid prototyping, 3D printing • Software: ABAQUS, Solidworks, AutoCAD, JMP, Matlab, and C. Email id: shinde.m.h@gmail.com

Mandar Shinde

Experience in developing electronic packages & systems with scope in mechanical design (CAD), simula...
Chandler, Arizona, United States

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Mandar Shinde’s Email mandar.shinde@intel.com

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Mandar Shinde’s Location Chandler, Arizona, United States

Mandar Shinde’s Current Industry Intel

Mandar Shinde’s Prior Industry Arizona State University | Nxp Semiconductors | Tata Motors | Cummins

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Mandar Shinde is a Experience in developing electronic packages & systems with scope in mechanical design (CAD), simulations (FEA) and characterization (Lab), assembly manufacturing processes, and enabling external suppliers. • Experience in developing LGA, FC-BGA architecture based electronic packages and sockets for LGA packages used in servers including test vehicles. • Mechanical simulations and testing expertise in 1) down selecting architectures, processes and materials that provide the best yield and reliability, 2) identifying technical root causes for thermomechanical assembly issues and providing solution options. • Experience in leading teams, project management, working with suppliers and yield improvement. Skills - • Product design, FEA analysis, assembly & manufacturability, and lab testing. • Design for manufacturability, yield, and reliability of semiconductor packages. • Manufacturing statistics, design of experiments, and technical problem solving. • Hands-on expertise in thermo-mechanical characterization and reliability testing of electronic packages. • New test methodology development, fixture design, rapid prototyping, 3D printing • Software: ABAQUS, Solidworks, AutoCAD, JMP, Matlab, and C. Email id: shinde.m.h@gmail.com