Junnan Zhao Email & Phone Number | o Industry experience on flip-chip substrate packaging pathfinding and technology development o Strong technical project management skill with proven success in delivering cutting-edge IC packaging technologies at Intel and Apple o Rich experience in supplier management skill by managing the world’s top tier substrate suppliers for high-end substrate development o Creative mindset for intellectual contribution: 20+ patents on various semiconducting packaging area including architecture design and manufacturing processes to incorporate advanced functions in the package o In-depth knowledge of assembly process, reliability methods, FMEA, DOE, statistical analysis and process control o Excellent soft skills: cross-functional team engagement, supplier communication, can-do attitude o 6+ years’ academic experience of materials sciences and analytical techniques

Junnan Zhao

o Industry experience on flip-chip substrate packaging pathfinding and technology development o Str...
Cupertino, California, United States

*50 free lookup(s) per month.

Junnan Zhao’s Email junnan.zhao@pmi.org

Junnan Zhao’s Phone Numbers

Get JUNNAN’s Phone Number (For Free)

Social Media

Junnan Zhao’s Location Cupertino, California, United States

Junnan Zhao’s Current Industry Apple

Junnan Zhao’s Prior Industry Intel | Eaton | University Of Michigan

Find accurate emails & phone numbers for over 700M professionals.

Packaging Substrate Engineer

2019-05-01 00:00:00 - Present

Senior Packaging Engineer

2016-02-01 00:00:00 - 2019-05-01 00:00:00

Materials Processing & Technologies Intern

2015-05-01 00:00:00 - 2015-08-01 00:00:00

Teaching Assistant

2014-09-01 00:00:00 - 2014-12-01 00:00:00

No Skills Available

No Languages Available

Junnan Zhao is a o Industry experience on flip-chip substrate packaging pathfinding and technology development o Strong technical project management skill with proven success in delivering cutting-edge IC packaging technologies at Intel and Apple o Rich experience in supplier management skill by managing the world’s top tier substrate suppliers for high-end substrate development o Creative mindset for intellectual contribution: 20+ patents on various semiconducting packaging area including architecture design and manufacturing processes to incorporate advanced functions in the package o In-depth knowledge of assembly process, reliability methods, FMEA, DOE, statistical analysis and process control o Excellent soft skills: cross-functional team engagement, supplier communication, can-do attitude o 6+ years’ academic experience of materials sciences and analytical techniques