Jeongcheol Kim
Quality and development in (MLB/BU) PCB and IC package substrate.
South Korea
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Jeongcheol Kim’s Email jeongcheol.kim@statschippac.com
Social Media
Jeongcheol Kim’s Location South Korea
Jeongcheol Kim’s Current Industry
Jeongcheol Kim’s Prior Industry Stats Chippac | Imbera Daeduck | Korea Circuit
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Work Experience
Stats Chippac
Manager
2010-07-01 00:00:00 - 2012-08-01 00:00:00
Imbera Daeduck
Manager
2009-06-01 00:00:00 - 2010-07-01 00:00:00
Korea Circuit
Deputy Manager
2002-10-01 00:00:00 - 2009-02-01 00:00:00Skills
Languages
FAQ About Jeongcheol Kim
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Jeongcheol Kim is located at
South Korea -
Jeongcheol Kim is a Quality and development in (MLB/BU) PCB and IC package substrate.
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Jeongcheol Kim currently works in the
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No Languages Available
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Jeongcheol Kim has prior
experience in the following industries:
Stats Chippac | Imbera Daeduck | Korea Circuit -
Jeongcheol Kim has the following professional experience:
Stats Chippac | Imbera Daeduck | Korea Circuit -
You can view Jeongcheol Kim’s LinkedIn profile at LinkedIn URL
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Jeongcheol Kim’s work email
addresses are
jeongcheol.kim@statschippac.com -
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