James Tian Email & Phone Number | Power Electronics engineer lead with demonstrated history of working in Automotive and Aerospace industries. Expertise in Silicon and WBG semiconductor power module (SiC/GaN/IGBT) characteristics and applications. Professional at Analog-digital hybrid high speed circuit design. Expertise in high power-density, highly-integrated, low profile and light design (Multichip, SoC, SiP, LTCC). Skilled in device/board/system level hardware design, FEA simulation and FPGA/MCU/DSP programming. Familiar with semiconductor manufacturing, Die level Micro-Assembly, SMT and IC packaging process. Experienced in Failure Mode and Effects Analysis (FMEA), Engineering Management, Production Part Approval Process (PPAP), Automotive and Radio Frequency (RF) Engineering. Proven strength in project management, new facility launches, business development, manufacturing management, negotiation and cross-functional global team management.

James Tian

Power Electronics engineer lead with demonstrated history of working in Automotive and Aerospace ind...
Royal Oak, Michigan, United States

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James Tian’s Location Royal Oak, Michigan, United States

James Tian’s Current Industry Stellantis

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Lead Engineer

2023-11-01 00:00:00 - Present

Electrical Engineer

2019-11-01 00:00:00 - 2022-02-01 00:00:00

Project Manager

2019-02-01 00:00:00 - 2019-11-01 00:00:00

Research And Development Intern

2018-02-01 00:00:00 - 2019-01-01 00:00:00

Junior Design Engineer

2016-02-01 00:00:00 - 2017-02-01 00:00:00

Process engineer manager - LTCC & Micro-assembly tech lead

2012-06-01 00:00:00 - 2014-06-01 00:00:00

R&D Engineer

2007-06-01 00:00:00 - 2012-06-01 00:00:00

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James Tian is a Power Electronics engineer lead with demonstrated history of working in Automotive and Aerospace industries. Expertise in Silicon and WBG semiconductor power module (SiC/GaN/IGBT) characteristics and applications. Professional at Analog-digital hybrid high speed circuit design. Expertise in high power-density, highly-integrated, low profile and light design (Multichip, SoC, SiP, LTCC). Skilled in device/board/system level hardware design, FEA simulation and FPGA/MCU/DSP programming. Familiar with semiconductor manufacturing, Die level Micro-Assembly, SMT and IC packaging process. Experienced in Failure Mode and Effects Analysis (FMEA), Engineering Management, Production Part Approval Process (PPAP), Automotive and Radio Frequency (RF) Engineering. Proven strength in project management, new facility launches, business development, manufacturing management, negotiation and cross-functional global team management.

James Tian has prior
experience in the following industries:
University Of Windsor | Apag Electroniks | Magna International | D And V Electronics | Institute Of Micro Electronics Chinese Academy Of Sciences | Institute Of Electronics Chinese Academy Of Sciences

James Tian has the following professional experience:
Stellantis | University Of Windsor | Apag Electroniks | Magna International | D And V Electronics | Institute Of Micro Electronics Chinese Academy Of Sciences | Institute Of Electronics Chinese Academy Of Sciences