Ilbok Lee
Experienced Packaging Intergration of FO-PLP, FO-WLP & Organic based CSP
South Korea, South Korea, South Korea
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Ilbok Lee’s Email ilbok.lee@amkor.com
Social Media
Ilbok Lee’s Location South Korea, South Korea, South Korea
Ilbok Lee’s Current Industry 삼성전자
Ilbok Lee’s Prior Industry Samsung Electro Mechanics | Amkor Technology
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Work Experience
삼성전자
Staff Engineer
2019-06-01 00:00:00 - Present
Samsung Electro Mechanics
Staff Engineer
2018-12-01 00:00:00 - 2019-05-01 00:00:00
Amkor Technology
Development Of Fo-Wlp
2015-10-01 00:00:00 - 2018-11-01 00:00:00Skills
Languages
FAQ About Ilbok Lee
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Ilbok Lee is located at
South Korea, South Korea, South Korea -
Ilbok Lee is a Experienced Packaging Intergration of FO-PLP, FO-WLP & Organic based CSP
-
Ilbok Lee currently works in the 삼성전자 |
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No Languages Available
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Ilbok Lee has prior
experience in the following industries:
Samsung Electro Mechanics | Amkor Technology -
Ilbok Lee has the following professional experience:
삼성전자 | Samsung Electro Mechanics | Amkor Technology -
You can view Ilbok Lee’s LinkedIn profile at LinkedIn URL
-
Ilbok Lee’s work email
addresses are
ilbok.lee@amkor.com -
삼성전자 |
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