Gunho Wang Email & Phone Number | ★ Amkor Technology Korea(1996.01 - 2003.09) - I had worked for 8 years as a substrate Engineer for raw material and Process engineer for Amkor Technology Korea who is the number one global company in semiconductor assembly. - Assembly Process Eng’r Group / D/A, W/B, Mold, Back-end) Process Eng’r for PBGA, flexBGA, CSP - Responsibility: Die attach, wire bonding, Mold, solder ball attach engineer at Front & back-end line process for PBGA(plastic ball grid array) assembly & package. - Responsibility: Die attach adhesive, Mold EMC, Substrate development engineer ★ Dae-Duck co. Substrate QA Group / Mgr (2003.10. 2004.02) - Responsibility: In charge of substrate quality control for PBGA, CSP - Major customer: Amkor Korea, Samsung electronic ★ Samsung Techwin (2004.04 - 2011.08) : Next Generation Development Group DS R&D Team / Senior Research Engineer - Responsibility: New Package & New Product & New Process Development - Develop of the small module design using system in package technology - Responsibility : Set up the Package & Reliability laboratory to test of the package substrate and lead frame. Also, developed the new package the BOC, FBGA, MCP. I'm responsible for this laboratory as a manger. This laboratory was made of the Package and Reliability process. Package process was composed of the wafer sawing, die attach, wire bonding, molding, solder ball attach, reflow, singulation. All machine were set up at this laboratory. -. Developed new product, BOC (Board on Chip) for memory package with Samsung electronic customer -. Responsibility : Develop embedded package of using flexible substrate to embedded

Gunho Wang

★ Amkor Technology Korea(1996.01 - 2003.09) - I had worked for 8 years as a substrate Engineer for...
South Korea, South Korea, South Korea

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Gunho Wang’s Email gunho.wang@mobis.co.kr

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Gunho Wang’s Location South Korea, South Korea, South Korea

Gunho Wang’s Current Industry Hyundai Mobis

Gunho Wang’s Prior Industry Amkor Technology

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Work Experience

Hyundai Mobis

Principal Reserach Engineer

2011-11-01 00:00:00 - Present

Amkor Technology

Senior Process Engineer

1996-01-01 00:00:00 - 2003-08-01 00:00:00

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FAQ About Gunho Wang

Gunho Wang is located at
South Korea, South Korea, South Korea

Gunho Wang is a ★ Amkor Technology Korea(1996.01 - 2003.09) - I had worked for 8 years as a substrate Engineer for raw material and Process engineer for Amkor Technology Korea who is the number one global company in semiconductor assembly. - Assembly Process Eng’r Group / D/A, W/B, Mold, Back-end) Process Eng’r for PBGA, flexBGA, CSP - Responsibility: Die attach, wire bonding, Mold, solder ball attach engineer at Front & back-end line process for PBGA(plastic ball grid array) assembly & package. - Responsibility: Die attach adhesive, Mold EMC, Substrate development engineer ★ Dae-Duck co. Substrate QA Group / Mgr (2003.10. 2004.02) - Responsibility: In charge of substrate quality control for PBGA, CSP - Major customer: Amkor Korea, Samsung electronic ★ Samsung Techwin (2004.04 - 2011.08) : Next Generation Development Group DS R&D Team / Senior Research Engineer - Responsibility: New Package & New Product & New Process Development - Develop of the small module design using system in package technology - Responsibility : Set up the Package & Reliability laboratory to test of the package substrate and lead frame. Also, developed the new package the BOC, FBGA, MCP. I'm responsible for this laboratory as a manger. This laboratory was made of the Package and Reliability process. Package process was composed of the wafer sawing, die attach, wire bonding, molding, solder ball attach, reflow, singulation. All machine were set up at this laboratory. -. Developed new product, BOC (Board on Chip) for memory package with Samsung electronic customer -. Responsibility : Develop embedded package of using flexible substrate to embedded