Eric Perfecto Email & Phone Number | Internationally recognized packaging process expert in the areas of solder interconnects, Cu-polymer multi-level structures, 2.5 and 3D wafer finishing and assembly. Extensive experience in the development of electronic packages and scale-up to manufacturing. Passionate focus on yield improvements through defect identification and elimination with a clear understanding of the role of tools, materials, process and the human factor. Exceptional ability to rapidly analyze defects in complex processes and structures and quickly determine which areas need to be investigated. IEEE Fellow in the areas of solder interconnect and multi-level thin films, and recognized industry expert with 3 book chapters, 87 papers, 58 US patents and 10 years as Instructor of the Flip Chip Professional Development Course at the ECTC. Specialties: Heterogeneous Integration, Packaging Assembly, Solder Interconnect, Chip Package Interaction, Electromigration, 2D/2.5D/3D structures, Interposers, White Bump, UBM selection, Solder Characterization, WPL, Quality, Reliability, Yield Improvements, FMEA, Defect Characterization, Root Cause Analysis, Ground Rules, Design for Manufacturing, Process Audits, Cross-Functional Team, Inventions, Patent Reviews, Inspection. Currently working at IBM Heterogeneous Integration area developing packages for accelerators for AI. Please contact me at Eric.Perfecto1@ibm.com For a list of publications see: www.researchgate.net/profile/Eric

Eric Perfecto

Internationally recognized packaging process expert in the areas of solder interconnects, Cu-polymer...
Poughkeepsie, New York, United States

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Eric Perfecto’s Email eperfecto@ibm.com

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Eric Perfecto’s Location Poughkeepsie, New York, United States

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Sr. Heterogeneous Integration Packaging Engineer

2019-09-01 00:00:00 - Present

Electronics Packaging Technologist

2018-11-01 00:00:00 - 2019-08-01 00:00:00

C4 and Wafer Finishing Integration

2015-06-01 00:00:00 - 2018-11-01 00:00:00

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Eric Perfecto is a Internationally recognized packaging process expert in the areas of solder interconnects, Cu-polymer multi-level structures, 2.5 and 3D wafer finishing and assembly. Extensive experience in the development of electronic packages and scale-up to manufacturing. Passionate focus on yield improvements through defect identification and elimination with a clear understanding of the role of tools, materials, process and the human factor. Exceptional ability to rapidly analyze defects in complex processes and structures and quickly determine which areas need to be investigated. IEEE Fellow in the areas of solder interconnect and multi-level thin films, and recognized industry expert with 3 book chapters, 87 papers, 58 US patents and 10 years as Instructor of the Flip Chip Professional Development Course at the ECTC. Specialties: Heterogeneous Integration, Packaging Assembly, Solder Interconnect, Chip Package Interaction, Electromigration, 2D/2.5D/3D structures, Interposers, White Bump, UBM selection, Solder Characterization, WPL, Quality, Reliability, Yield Improvements, FMEA, Defect Characterization, Root Cause Analysis, Ground Rules, Design for Manufacturing, Process Audits, Cross-Functional Team, Inventions, Patent Reviews, Inspection. Currently working at IBM Heterogeneous Integration area developing packages for accelerators for AI. Please contact me at Eric.Perfecto1@ibm.com For a list of publications see: www.researchgate.net/profile/Eric_Perfecto