Eric Gelvin

Eric Gelvin

Principal Package Design Engineer
Phoenix, Arizona, United States

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Work Experience

Renesas Electronics

Principal Package Design Engineer

2023-10-01 - Present

ON Semiconductor

Member of Technical Staff-Package Development

2020-12-01 - 2023-10-01

UGS America Sales Inc.

Technical Program Manager

2017-05-01 - 2020-12-01

NXP Semiconductors

Cost Model / Value Engineering Manager

2014-12-01 - 2017-05-01

Freescale Semiconductor

Global Commodity Manager

2009-06-01 - 2014-12-01

Intel Corporation

Sr. Quality & Reliability Engineer

1995-05-01 - 2007-05-01

Skills

semiconductors hardware information technology semiconductor design & manufacturing microcontrollers mcu analog power management adas iot solutions automotive home electronics office automation information communication technology

Languages

English Chinese