Eric Gastelum Email & Phone Number | Supporting new product introduction at Broadcom. Mainly supporting wafer level packaging for mobile and wearable applications. My responsibilities include : Package Selection, Feasibility Studies, Package Substrate and Bump Mask Design, Substrate and Bump Mask Procurement, Package Assembly, Package Qualification, Failure Analysis, HVM Production Bring Up, and sustaining support.

Eric Gastelum

Supporting new product introduction at Broadcom. Mainly supporting wafer level packaging for mobile...
Irvine, California, United States

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Eric Gastelum’s Email egastelum@broadcom.com

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Eric Gastelum’s Location Irvine, California, United States

Eric Gastelum’s Current Industry Broadcom

Eric Gastelum’s Prior Industry Appliedmicro

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Principal Engineer R&D, IC Package Engineering

2022-11-01 00:00:00 - Present

Packaging Intern

2008-10-01 00:00:00 - 2010-07-01 00:00:00

No Skills Available

No Languages Available

Eric Gastelum is a Supporting new product introduction at Broadcom. Mainly supporting wafer level packaging for mobile and wearable applications. My responsibilities include : Package Selection, Feasibility Studies, Package Substrate and Bump Mask Design, Substrate and Bump Mask Procurement, Package Assembly, Package Qualification, Failure Analysis, HVM Production Bring Up, and sustaining support.