Chun Jin Ling Email & Phone Number | - As a Quality (FA) engineer to path finding the root cause of rejected products from customer and providing a comprehensive FA report with corrective solution to customer. - Perform full electrical verification and fault isolation on quality and reliability rejects as well as customer rejects - Perform full physical failure analysis to localize substrate and Si level physical defects for wafer fab yield improvement and closure on customer rejects - Perform module/board level WLBGA/WLCSP (wafer level mobility chip) extraction on customers products for electrical test and fault isolation

Chun Jin Ling

- As a Quality (FA) engineer to path finding the root cause of rejected products from customer and p...
Bayan Lepas, Bayan Lepas, Malaysia

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Chun Jin Ling’s Email cling@broadcom.com

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Chun Jin Ling’s Location Bayan Lepas, Bayan Lepas, Malaysia

Chun Jin Ling’s Current Industry Broadcom

Chun Jin Ling’s Prior Industry Intel

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Quality Engineer

2016-03-01 00:00:00 - Present

Transmission Electron Microscopy Analysist

2013-03-01 00:00:00 - 2016-02-01 00:00:00

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Chun Jin Ling is a - As a Quality (FA) engineer to path finding the root cause of rejected products from customer and providing a comprehensive FA report with corrective solution to customer. - Perform full electrical verification and fault isolation on quality and reliability rejects as well as customer rejects - Perform full physical failure analysis to localize substrate and Si level physical defects for wafer fab yield improvement and closure on customer rejects - Perform module/board level WLBGA/WLCSP (wafer level mobility chip) extraction on customers products for electrical test and fault isolation