Christopher Prindle Email & Phone Number | Technology Program Manager & Lead Process Integration Engineer with 25 years of professional experience in the semiconductor industry, specializing in customer-facing manufacturing of high-volume RF products, as well as silicon CMOS device research and development. Collaborated with diverse multinational teams in five world-class 200mm and 300mm wafer fabs in the United States, Germany, and France. Career encompasses work on 10 advanced technology generations (130nm through 3nm) and module team leadership throughout the entire process flow for CMOS logic and SRAM fabrication, including FEOL, MOL, and BEOL. Innovative technologist with high level of scientific creativity and deep understanding of wafer-level process flow and materials.

Christopher Prindle

Technology Program Manager & Lead Process Integration Engineer with 25 years of professional experie...
Hopewell Junction, New York, United States

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Christopher Prindle’s Email cprindle@onsemi.com

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Christopher Prindle’s Location Hopewell Junction, New York, United States

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Christopher Prindle’s Prior Industry Onsemi | Globalfoundries | Amd | Freescale Semiconductor | Motorola

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3D Heterogeneous Integration Engineer

2024-03-01 00:00:00 - Present

Technology Program Manager & Lead Process Integration Engineer

2023-01-01 00:00:00 - 2024-03-01 00:00:00

RF Integration Engineer & Program Manager

2019-01-01 00:00:00 - 2023-01-01 00:00:00

FEOL and MOL Process Integration Engineer

2005-08-01 00:00:00 - 2010-03-01 00:00:00

BEOL Process Integration Engineer

2002-12-01 00:00:00 - 2005-07-01 00:00:00

BEOL Process Integration Engineer

1999-06-01 00:00:00 - 2002-12-01 00:00:00

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Christopher Prindle is a Technology Program Manager & Lead Process Integration Engineer with 25 years of professional experience in the semiconductor industry, specializing in customer-facing manufacturing of high-volume RF products, as well as silicon CMOS device research and development. Collaborated with diverse multinational teams in five world-class 200mm and 300mm wafer fabs in the United States, Germany, and France. Career encompasses work on 10 advanced technology generations (130nm through 3nm) and module team leadership throughout the entire process flow for CMOS logic and SRAM fabrication, including FEOL, MOL, and BEOL. Innovative technologist with high level of scientific creativity and deep understanding of wafer-level process flow and materials.