Chris Jones Email & Phone Number | I have worked on a variety of interesting nanotechnology projects involving advanced nanoimprint lithography over the past 16 years including: whole wafer planarization, template and mask replication development for HDD and CMOS, photonic crystal patterning of LED wafers, wire grid polarizers, bit pattern and discrete track patterning for magnetic storage, 3D microlens arrays for CMOS imaging, MEMS prototyping, and surface acoustic wave filters. I have enjoyed developing and optimizing semiconductor processes involving a wide variety of substrate types and the unique challenges they present including: 50mm - 300mm Silicon, 50-75mm SiC, Sapphire, GaN, GaAs and InP, 100mm LiNbO3, LiTaO3, and Quartz, 150-300mm fused silica, 6025 square substrates, 48mm and 65mm glass disks. I work with features down to 10nm, which requires rigorous metrology skills. I routinely operate and analyze a large variety of metrology data from tools including, CD-SEM, AFM, IPRO image placement, Zygo laser interferometry, Candela 6120 and CS20 surface inspection, thin film metrology, and image processing software. All of these are key in performing demanding process and application support for our customers as well as for development of our new products. Specialties: Nanoimprint Lithography, Process Development, Dry Etch Development, LED processing, Bit Pattern Media and Discrete Track Media processing, Semiconductor processing, Materials Chemistry, Surface Acoustic Wave Devices, Adhesive Wafer Bonding, Thin and Thick Film Photoresist processing, thin film deposition, deep Si and SiO2 etching, MEMS prototyping, wafer level packaging, hermetic metrology, SEM CD metrology, Corrosion, Superconductivity, Photolithography.

Chris Jones

I have worked on a variety of interesting nanotechnology projects involving advanced nanoimprint lit...
1807 West Braker Lane, Austin, United States

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Chris Jones’s Email cjones@cusa.canon.com

Chris Jones’s Phone Numbers +1 512-339-****

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Chris Jones’s Location 1807 West Braker Lane, Austin, United States

Chris Jones’s Current Industry Canon Nanotechnologies

Chris Jones’s Prior Industry Molecular Imprints | Clarisay

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Work Experience

Canon Nanotechnologies

Principal Engineer II

2023-02-01 00:00:00 - Present

Molecular Imprints

CMOS Applications Manager

2011-05-01 00:00:00 - 2014-04-01 00:00:00

Clarisay

Materials Scientist

2000-11-01 00:00:00 - 2004-01-01 00:00:00

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FAQ About Chris Jones

Chris Jones is located at
1807 West Braker Lane, Austin, United States

Chris Jones is a I have worked on a variety of interesting nanotechnology projects involving advanced nanoimprint lithography over the past 16 years including: whole wafer planarization, template and mask replication development for HDD and CMOS, photonic crystal patterning of LED wafers, wire grid polarizers, bit pattern and discrete track patterning for magnetic storage, 3D microlens arrays for CMOS imaging, MEMS prototyping, and surface acoustic wave filters. I have enjoyed developing and optimizing semiconductor processes involving a wide variety of substrate types and the unique challenges they present including: 50mm - 300mm Silicon, 50-75mm SiC, Sapphire, GaN, GaAs and InP, 100mm LiNbO3, LiTaO3, and Quartz, 150-300mm fused silica, 6025 square substrates, 48mm and 65mm glass disks. I work with features down to 10nm, which requires rigorous metrology skills. I routinely operate and analyze a large variety of metrology data from tools including, CD-SEM, AFM, IPRO image placement, Zygo laser interferometry, Candela 6120 and CS20 surface inspection, thin film metrology, and image processing software. All of these are key in performing demanding process and application support for our customers as well as for development of our new products. Specialties: Nanoimprint Lithography, Process Development, Dry Etch Development, LED processing, Bit Pattern Media and Discrete Track Media processing, Semiconductor processing, Materials Chemistry, Surface Acoustic Wave Devices, Adhesive Wafer Bonding, Thin and Thick Film Photoresist processing, thin film deposition, deep Si and SiO2 etching, MEMS prototyping, wafer level packaging, hermetic metrology, SEM CD metrology, Corrosion, Superconductivity, Photolithography.