Chengwu Zhang Email & Phone Number | √ Chemical Engineering Ph.D. with 8+ years of hands-on experiences in semiconductor technologies and processes. A self-motivated and result-driven professional with expertise in semiconductor process, equipment and integration. −−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−− √ Area of Expertise: thin film deposition and lithography. −−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−− √ Technical skills: • Thin film deposition: ALD, CVD and PVD. • Lithography: photolithography and e-beam lithography. • Characterization and Analysis: SEM, STEM/TEM, FIB, XPS, SIMS, Ellipsometry, XRD, XRR, 4-point probe, XRF, TXRF and AFM. • Statistical Analysis: Design of Experiments (DOE), Statistical Process Control (SPC), Engineering Statistics and Data Analysis, Robust Optimization and Tolerance Design, and Measurement System Analysis. • Software: JMP, Origin, MATLAB, AutoCAD, ImageJ, FDTD, COMOL, Gaussian and Aspen plus.

Chengwu Zhang

√ Chemical Engineering Ph.D. with 8+ years of hands-on experiences in semiconductor technologies and...
Hillsboro, Oregon, United States

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Chengwu Zhang’s Email chengwu.zhang@asm.com

Chengwu Zhang’s Phone Numbers

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Chengwu Zhang’s Location Hillsboro, Oregon, United States

Chengwu Zhang’s Current Industry Intel

Chengwu Zhang’s Prior Industry Asm | University Of Connecticut | Lam Research

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LTD Module & Integration Yield Engineer

2023-12-01 00:00:00 - Present

Senior Process Engineer

2021-08-01 00:00:00 - 2023-11-01 00:00:00

Graduate Research Assistant

2016-08-01 00:00:00 - 2021-08-01 00:00:00

Process Engineering Intern

2020-05-01 00:00:00 - 2020-08-01 00:00:00

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Chengwu Zhang is a √ Chemical Engineering Ph.D. with 8+ years of hands-on experiences in semiconductor technologies and processes. A self-motivated and result-driven professional with expertise in semiconductor process, equipment and integration. −−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−− √ Area of Expertise: thin film deposition and lithography. −−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−− √ Technical skills: • Thin film deposition: ALD, CVD and PVD. • Lithography: photolithography and e-beam lithography. • Characterization and Analysis: SEM, STEM/TEM, FIB, XPS, SIMS, Ellipsometry, XRD, XRR, 4-point probe, XRF, TXRF and AFM. • Statistical Analysis: Design of Experiments (DOE), Statistical Process Control (SPC), Engineering Statistics and Data Analysis, Robust Optimization and Tolerance Design, and Measurement System Analysis. • Software: JMP, Origin, MATLAB, AutoCAD, ImageJ, FDTD, COMOL, Gaussian and Aspen plus.