Cheng Tan Email & Phone Number | RF, Microwave, Analog, Digital, Power, Chip, and Board level designs. • System Noise, Power, Linearity Budgeting • Complex designs for PCB Level, and Chip Level • RF, Microwave, Analog, Switch Mode Power, Audio, and Digital designs • Switch Mode Power Supply architecture, control, analysis, and implementation • LNA, PA, Mixer, PLL, Oscillator, OPAMP, FET, BJT, Combinational/Sequential Logic, CPU • ADS/EESOF, Momentum, Cadence, Spice simulators • Strip, Microstrip, Wideband Zo/TEM, LVDS, Eye Diagram, Isolation, Delay, Dispersion • PCB Layout, Materials, Loss, Parasitic, via, Thermal, Supplier, Cost, SMT readiness • Enjoyed and excelled in team environment. trained and led design teams

Cheng Tan

RF, Microwave, Analog, Digital, Power, Chip, and Board level designs. • System Noise, Power, Linea...
Denver, Colorado, United States

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Cheng Tan’s Location Denver, Colorado, United States

Cheng Tan’s Current Industry Qualcomm

Cheng Tan’s Prior Industry Rfmd | Qualcomm Kyocera | Nortel Technology

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Pricipal Engr

1997-03-01 00:00:00 - Present

Intern; Senior Engineer

2004-04-01 00:00:00 - 2005-10-01 00:00:00

Staff HW Engineer

1997-01-01 00:00:00 - 2003-12-01 00:00:00

Intern

1995-01-01 00:00:00 - 1996-12-01 00:00:00

No Skills Available

No Languages Available

Cheng Tan is a RF, Microwave, Analog, Digital, Power, Chip, and Board level designs. • System Noise, Power, Linearity Budgeting • Complex designs for PCB Level, and Chip Level • RF, Microwave, Analog, Switch Mode Power, Audio, and Digital designs • Switch Mode Power Supply architecture, control, analysis, and implementation • LNA, PA, Mixer, PLL, Oscillator, OPAMP, FET, BJT, Combinational/Sequential Logic, CPU • ADS/EESOF, Momentum, Cadence, Spice simulators • Strip, Microstrip, Wideband Zo/TEM, LVDS, Eye Diagram, Isolation, Delay, Dispersion • PCB Layout, Materials, Loss, Parasitic, via, Thermal, Supplier, Cost, SMT readiness • Enjoyed and excelled in team environment. trained and led design teams