Anderson Beluso Email & Phone Number | 12 years knowledge on Semiconductor Package , Specialist on the Compression and Transfer Molding Process (MUF/BGA), Laser Marking and Package Singulation in Back End area. New Product Introduction (NPI), Maintenance (MEE) and Process support (PE). Analyze and develop FAI for process, tooling and material management. Technician management team, Development, monitoring and following the quality tooling control (quality methodologies as Pareto, root cause analysis, Six Sigma, FMEA, 8D , DMAIC, DFMEA, PFMEA, QCPlan, Working instructions, Equipment control, SPC), process issues analyzes.

Anderson Beluso

12 years knowledge on Semiconductor Package , Specialist on the Compression and Transfer Molding Pro...
Jundiaí, Jundiaí, Brazil

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Anderson Beluso’s Location Jundiaí, Jundiaí, Brazil

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Anderson Beluso’s Prior Industry Huf Do Brasil

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PL Process Engineer

Present

Estagiário

2009-07-01 00:00:00 - 2010-12-01 00:00:00

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Anderson Beluso is a 12 years knowledge on Semiconductor Package , Specialist on the Compression and Transfer Molding Process (MUF/BGA), Laser Marking and Package Singulation in Back End area. New Product Introduction (NPI), Maintenance (MEE) and Process support (PE). Analyze and develop FAI for process, tooling and material management. Technician management team, Development, monitoring and following the quality tooling control (quality methodologies as Pareto, root cause analysis, Six Sigma, FMEA, 8D , DMAIC, DFMEA, PFMEA, QCPlan, Working instructions, Equipment control, SPC), process issues analyzes.