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Alex Tresky

Prsident
Zuerich, Zurich, Switzerland

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Skills

fine placing flip chip bonding microassembly micropackaging eutectic die bonding epoxy die bonding solder paste die attach silver sintering die bonding thermocompression die bonding die bonder photo diodes microwave modules rf packages solid state lasers vcsel pd dfb laser lens attach chiponboard hybrid microcircuits mems moems ultrasonic die bonding high force bonding

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